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Design Centers

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Automotive & Transportation
 Kappa optronics Partnering with Mission H24: Innovative Hydrogen Race Car with Digital Mirrors

 Zevtron Partners with SpotGenius to Monitor EV Charging Spaces with Vision AI Technology

 FORVIA HELLA and Tau Motors Partner to Develop Advanced Charging Solutions

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Batteries & Other Energy Storage Devices
 Power Up Connect Launches the World's First of Its Kind Mobile Battery Storage System

 Pfannenberg USA Introduces Next-Generation BESS Chillers: VLV and DMC Series Redefine Battery Thermal Management

 Zevtron Partners with SpotGenius to Monitor EV Charging Spaces with Vision AI Technology

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Consumer
 Chromasens Launches New Flagship of allPIXA evo Line-Scan Camera Series

 TDK Presents Ultra-Small PFC Capacitors for Space-Constrained Consumer Applications

 Infineon’s New EZ USBâ„¢ FX2G3

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Data Centers
 Toshiba Launches 650V 3rd Generation SiC MOSFETs in Compact TOLL Package

 The Future of Powering AI: Redefining Power Flow from Grid-to-Core in Data Centers

 Heilind Expands Inventory with Molex Mini-Fit Low Mating Force Terminal Series

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EV, Hybrids & Charging Infrastructure
 Zevtron Partners with SpotGenius to Monitor EV Charging Spaces with Vision AI Technology

 FORVIA HELLA and Tau Motors Partner to Develop Advanced Charging Solutions

 Solid-State Batteries Get Closer to Mass Manufacture

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Industrial
 SEGGER J-Link and Flasher Product Families now Support Geehy G32R50x MCUs

 Littelfuse Launches Industry’s Smallest 3 kA TVS Diode in Compact Surface Mount Package

 ROHM Develops and Ultra-Compact CMOS Op Amp Featuring Industry-Leading Ultra-Low Circuit Current

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IoT & Smart Cities
 SEGGER Establishes Programming-Support Partnership with Winbond Electronics Corporation

 Toshiba Launches 650V 3rd Generation SiC MOSFETs in Compact TOLL Package

 Mouser Provides Design Engineers with Digital Defense Knowledge in New Security Resource Center

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Lighting & Illumination
 iDEAL Semiconductor Announces 200 V Family of SuperQ-based MOSFETs With Industry-Leading Cost x Performance

 Lighting’s Uncertain Future

 Lighting the Future

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Medical, Healthcare & Wellness
 Heilind Electronics Now Stocks 3M Four-Wall Header 2500 Series

 Heilind Features Molex’s Flexible Premo-Flex Jumpers for Space-Constrained Interconnect Designs

 AI-powered Medical Devices Market to Achieve $124.6 billion by 2033

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Military, Aerospace & Hi-Rel
 Arrow Electronics Extends Distribution Agreement with Molex by Adding AirBorn

 KYOCERA AVX Releases Novel Stacked Capacitors

 U.S. Army Taps LiquidPiston to Build Ultra-Compact Mobile Command Post Auxiliary Power Unit

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Motor Drives, Robotics & Controls
 iDEAL Semiconductor Announces 200 V Family of SuperQ-based MOSFETs With Industry-Leading Cost x Performance

 Advanced Energy Launches 1300 and 1600 W Ultra Efficient DC-DC Converter

 Integrated E-Drives Redefined - Hollow-Conductor Cooling Meets Scalable SiC Inverter Technology

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Power Modules
 Power Electronics Market is Expected to Generate a Revenue of $184.81 Billion by 2031, Globally, at 7.05%

 8 EV Challenges of Converting High Voltage to SELV

 15W AC/DC Power Modules feature Widest Input Range

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Power Semiconductors
 TDK Presents Ultra-Small PFC Capacitors for Space-Constrained Consumer Applications

 KYOCERA AVX Releases Novel Stacked Capacitors

 Toshiba Launches 650V 3rd Generation SiC MOSFETs in Compact TOLL Package

more
Power Supplies
 TDK Presents Ultra-Small PFC Capacitors for Space-Constrained Consumer Applications

 KYOCERA AVX Releases Novel Stacked Capacitors

 Toshiba Launches 650V 3rd Generation SiC MOSFETs in Compact TOLL Package

more
Powering AI
 Infineon Introduces AURIX TC4x Software to Enable Quality, Safety, and Security in Automotive Applications

 iDEAL Semiconductor Announces 200 V Family of SuperQ-based MOSFETs With Industry-Leading Cost x Performance

 The Future of Powering AI: Redefining Power Flow from Grid-to-Core in Data Centers

more
Powering Communications
 Infineon Introduces AURIX TC4x Software to Enable Quality, Safety, and Security in Automotive Applications

 The Future of Powering AI: Redefining Power Flow from Grid-to-Core in Data Centers

 Nordic Semiconductor Launches nRF Connect SDK Bare Metal Option for nRF54L Series

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Powering Embedded Systems
 15W AC/DC Power Modules feature Widest Input Range

 Molded Inductors

 TTI Europe Acquires Specialist Transportation Cable Assembly Manufacturer and Interconnect Distributor Raffenday Limited

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Renewable Energy
 SEGGER J-Link and Flasher Product Families now Support Geehy G32R50x MCUs

 Nautilus Solar Energy Secures $275 Million Financing to Accelerate Community Solar Growth in Five Key States

 Low-Carbon Ammonia and Methanol Hold Potential in Energy Transition but Face Uncertain Outlook, says GlobalData

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Smart Power Grid
 Custom Electronics, Inc. and GridEdge Networks Launch 69kV Grid Safety Solution for Distributed Energy Resources

 Stabilizing the Electric Grid

 Optimizing Flying Capacitor Multilevel Converters for GaN Technology

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Test & Measurement
 SEGGER’s Ozone is now Available for Simulators and Third-Party Probes

 Heilind Electronics Now Stocks 3M Four-Wall Header 2500 Series

 Infineon’s New EZ USBâ„¢ FX2G3

more
Wearables & Nanopower
 15W AC/DC Power Modules feature Widest Input Range

 TTI Europe Acquires Specialist Transportation Cable Assembly Manufacturer and Interconnect Distributor Raffenday Limited

 Â­0.635 mm pitch, Slim Body Edge Rate Connectors

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White Goods
 Same Sky Expands Peltier Modules Product Offering

 Optimizing Flying Capacitor Multilevel Converters for GaN Technology

 15W AC/DC Power Modules feature Widest Input Range

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Wide-Bandgap Semis
 Power Integrations Rolls Out Reference Design Kit for Solar Race Cars Featuring High-Efficiency Gallium-Nitride IC

 SiC-On-Insulator & Substrate Technologies Poised to Achieve $149 Million Market Value by 2029

 onsemi and Schaeffler Expand Collaboration with New EliteSiC-based PHEV Platform

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