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Power Up Connect Launches the World's First of Its Kind Mobile Battery Storage System

Power Up Connect Launches the World's First of Its Kind Mobile Battery Storage System

Power Up Connect Launches the World's First of Its Kind Mobile Battery Storage System
­Power Up Connect has introduced the MBESS 90 kWh, recognized as the world's first International Fire Code compliant Mobile Battery Energy Storage System. This milestone represents the result of a three-year collaboration between Power Up Connect and Dominion Energy. Currently, the MBESS 90 kWh is the only MBE
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Date:
09/11/2025
SEGGER J-Link and Flasher Product Families now Support Geehy G32R50x MCUs

SEGGER J-Link and Flasher Product Families now Support Geehy G32R50x MCUs

SEGGER J-Link and Flasher Product Families now Support Geehy G32R50x MCUs
SEGGER's market-leading J-Link debug probes and Flasher in-system programmers can now be used with Geehy's G32R50x series of real-time microcontroller units (MCUs). G32R50x MCUs are based on the Arm® Cortex®-M52 core and deliver real-time control capabilities. Offering computational efficiency,
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Date:
09/11/2025
Littelfuse Launches Industry’s Smallest 3 kA TVS Diode in Compact Surface Mount Package

Littelfuse Launches Industry’s Smallest 3 kA TVS Diode in Compact Surface Mount Package

Littelfuse Launches Industry’s Smallest 3 kA TVS Diode in Compact Surface Mount Package
­Littelfuse, Inc. announced the launch of the DFNAK3 Series of High-Power TVS Diodes. These compact surface mount devices deliver 3 kA (8/20 µs) surge current protection—the highest available in such a small footprint—making them ideal for safeguarding DC-powered systems and Power over Ethernet (PoE) app
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Date:
09/10/2025
ROHM Develops and Ultra-Compact CMOS Op Amp Featuring Industry-Leading Ultra-Low Circuit Current

ROHM Develops and Ultra-Compact CMOS Op Amp Featuring Industry-Leading Ultra-Low Circuit Current

ROHM Develops and Ultra-Compact CMOS Op Amp Featuring Industry-Leading Ultra-Low Circuit Current
­ROHM Semiconductor announced the development of the TLR1901GXZ, an ultra-compact CMOS operational amplifier (op amp) that achieves the industry’s lowest operating circuit current. Optimized for use as a sensing amplifier, this IC is ideally suited for space-constrained applications su
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Date:
09/10/2025
Chromasens Launches New Flagship of allPIXA evo Line-Scan Camera Series

Chromasens allPIXA evo 32k

Chromasens Launches New Flagship of allPIXA evo Line-Scan Camera Series
­Chromasens unveiled its new allPIXA evo 32k line-scan camera, which achieves an amazing 73 kHz line rate at full resolution by combining a CoaXPress CXP-12 four-lane interface with a CMOS multi-line 32768-pixel monochrome sensor. The new flagship to the company's allPIXA evo Series, the
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Date:
09/10/2025
TDK Presents Ultra-Small PFC Capacitors for Space-Constrained Consumer Applications

TDK Presents Ultra-Small PFC Capacitors for Space-Constrained Consumer Applications

TDK Presents Ultra-Small PFC Capacitors for Space-Constrained Consumer Applications
TDK Corporation introduces the B3270xP, a series of ultra-small, metallized polypropylene (MKP) film capacitors tailored for power factor correction (PFC) stages in power supplies for consumer electronics. With their compact design and self-healing properties, these components are engineered for use in adapters an
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Date:
09/09/2025
SEGGER’s Ozone is now Available for Simulators and Third-Party Probes

SEGGER’s Ozone is now Available for Simulators and Third-Party Probes

SEGGER’s Ozone is now Available for Simulators and Third-Party Probes
­SEGGER’s powerful Ozone debugger and performance analyzer, long trusted by users of J-Link and J-Trace, is now available for third-party debug probes and simulators.  Using the industry-standard GDB Remote Protocol, Ozone is now accessible to a much broader range of developers. “After listening to req
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Date:
09/09/2025
KYOCERA AVX Releases Novel Stacked Capacitors

KYOCERA AVX Releases Novel Stacked Capacitors

KYOCERA AVX Releases Novel Stacked Capacitors
­KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released the new DSCC 25007 Mini BME Stacks — miniature, high-CV stacked X7R capacitors equipped with base metal electrodes (BME) and subjected to 100% Gr
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Date:
09/08/2025
Pfannenberg USA Introduces Next-Generation BESS Chillers: VLV and DMC Series Redefine Battery Thermal Management

Pfannenberg USA Introduces Next-Generation BESS Chillers: VLV and DMC Series Redefine Battery Thermal Management

Pfannenberg USA Introduces Next-Generation BESS Chillers: VLV and DMC Series Redefine Battery Thermal Management
­Pfannenberg, Inc., a global leader in thermal management and signaling technologies, is proud to announce the launch of its latest innovation in battery energy storage system (BESS) solutions: the award-winning VLV 4-12 and DMC 8.0 Chillers, engineered specifically for the demanding needs of today’s BE
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Date:
09/08/2025
Infineon Introduces AURIX TC4x Software to Enable Quality, Safety, and Security in Automotive Applications

Patrick Will, Senior Director and Head of Software Product Marketing and Management at Infineon

Infineon Introduces AURIX TC4x Software to Enable Quality, Safety, and Security in Automotive Applications
­Infineon Technologies AG has launched a comprehensive software portfolio designed specifically for the latest AURIX™ TC4x microcontroller (MCU) family. It enables automotive safety applications with production ready ASIL D drivers for the AUTOSAR MCAL and safety software. By reducing efforts for software pa
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Date:
09/04/2025
Heilind Electronics Now Stocks 3M Four-Wall Header 2500 Series

Heilind Electronics Now Stocks 3M Four-Wall Header 2500 Series

Heilind Electronics Now Stocks 3M Four-Wall Header 2500 Series
­Heilind Electronics, a leading global distributor of interconnect, electromechanical, and sensor solutions, is pleased to announce that it now stocks the 3M™ Four-Wall Header 2500 Series, a versatile 100″ × .100″ wire-to-board connector designed to deliver space-saving performance, reliable mating, an
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Date:
09/04/2025
iDEAL Semiconductor Announces 200 V Family of SuperQ-based MOSFETs With Industry-Leading Cost x Performance

iDEAL Semiconductor Announces 200 V Family of SuperQ-based MOSFETs With Industry-Leading Cost x Performance

iDEAL Semiconductor Announces 200 V Family of SuperQ-based MOSFETs With Industry-Leading Cost x Performance
­iDEAL Semiconductor has announced the first of its 200 V family of SuperQ™-based MOSFETs has entered mass production, with four additional 200 V devices now sampling. SuperQ is the first major advance in silicon MOSFET technology in more than 25 years, breaking through long-standing limits in switching
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Date:
09/04/2025
SEGGER Establishes Programming-Support Partnership with Winbond Electronics Corporation

SEGGER Establishes Programming-Support Partnership with Winbond Electronics Corporation

SEGGER Establishes Programming-Support Partnership with Winbond Electronics Corporation
­Effective immediately, SEGGER programming support is available for selected SPI flash-memory devices from Winbond Electronics Corporation. SEGGER’s highly regarded J-Link and Flasher product lines are now fully compatible with Winbond's high-performance W25H, W25Q, and W25X SpiFlash® multi-input/-output (I/O)
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Date:
09/04/2025
Toshiba Launches 650V 3rd Generation SiC MOSFETs in Compact TOLL Package

Toshiba Launches 650V 3rd Generation SiC MOSFETs in Compact TOLL Package

Toshiba Launches 650V 3rd Generation SiC MOSFETs in Compact TOLL Package
­Toshiba Electronics Europe GmbH (“Toshiba”) announces the release of three new 650V silicon carbide (SiC) MOSFETs, which incorporate its latest 3rd generation SiC MOSFET chips. The TW027U65C, TW048U65C, and TW083U65C are housed in a surface-mount TOLL package and are designed to reduce switching losses in
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Date:
09/02/2025
Vero's Range of PCB Prototyping Aids and Accessories now Stocked at Anglia

Vero's Range of PCB Prototyping Aids and Accessories now Stocked at Anglia

Vero's Range of PCB Prototyping Aids and Accessories now Stocked at Anglia
­Anglia Components is now stocking an extensive range of PCB Prototyping aids and accessories from UK company Vero Technologies Ltd. The two companies have signed an agreement covering the UK and the EU, giving Anglia’s customer base access to a wide range of products and accessories for PCB prototyping, te
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Date:
09/02/2025
Bourns Miniature Thermal Cutoff Mini-Breaker Series Supports New 240 Watt USB Power Delivery Standard Limit

Bourns® SE Series resettable miniature Thermal Cutoff (TCO) Mini-Breakers

Bourns Miniature Thermal Cutoff Mini-Breaker Series Supports New 240 Watt USB Power Delivery Standard Limit
­Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today introduced its SE Series miniature Thermal Cutoff (TCO) Mini-Breaker devices that are designed to support 240 W, which meets the upper limit of the USB Power Delivery (P
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Date:
09/02/2025
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